General InformationManufacturer: HPE
Manufacturer Part Number: P28225-B21
Type: Memory (RAM)
Product Name:HPE Synergy 32GB (1X32GB) Dual Rank X4 DDR4-2933 Cas-21-21-21 Registered Smart Memory Kit
Product Type: Ram Module
Technical InformationStorage Capacity: 32GB
Memory Type: DDR4 SDRAM - Dimm 288-Pin
Number Of Modules: 1 X 32GB
Memory Speed: 2933mhz (Pc4-23400)
Features: Dual Rank X4, Registered
Error Checking: Ecc
Voltage: 1.2 V
Latency Timings: Cl21 (21-21-21)
Upgrade Type: System Specific
Designed For: HPE Synergy 480 Gen10 Base Compute Module, 480 Gen10 Compute Module, 480 Gen10 Entry Compute Module, 480 Gen10 Performance Compute Module, 480 Gen10 Premium Backplane Compute Module, 480 Gen10 Standard Backplane Compute Module, 480 Gen10 W/o Drives Compute Module, 660 Gen10 Base Compute Module, 660 Gen10 Compute Block, 660 Gen10 Compute Module, 660 Gen10 Entry Compute Module, 660 Gen10 Performance Compute Module, 660 Gen10 Premium Compute Module
About New Bulk Pack Products
Most enterprises in today's world store their application on servers and distribute them to several virtual machines. For this reason, it is crucial to have a reliable server memory, and that's what the PC4 23400 RAM offers. It maximizes a server's installed memory capacity. It is one of the most affordable means of carrying out faster and more efficient deployments.
These drives contain register chips that help direct data commands and control data flow within a server. With these register chips, PC4 23400 RAMs prevent or minimize data errors and ensure that there is an increase in overall system reliability. For example, NEMIX manufactured its RAM with top brand chips. These chips include Micron, Samsung, Hynix, and Elpida, and they meet or exceed manufacturer specifications as well as JEDEC standards.
Installing one of the NEMIX PC4 23400 RAM ensures that a server's computing potential is optimized. It functions as a non-shared component, so it offers fewer bugs than storage drives or processors. Just like how pre-installed server's components are upgraded, these types of memory work the same way. These PC4 23400 RAMs are optimized to be compatible with the latest processor products, allowing them to work perfectly with servers and micro workstations, depending on capacity choice.
The dedicated amount of memory that a virtual machine that runs on a server requires depends on such a machine's workload. The PC4 23400 RAM comes with the latest DRAM technologies, allowing more gigabit per component. For example, 16Gb-based memories use higher density components to give modules with two times the density of 8Gb-based memory modules.
These DDR4 memories have module densities up to 64GB and speeds that are up to 2940 MT/s. Hence, they can increase the installed memory capacities of every server while maximizing system performance. This server memory is built to last, thanks to the industry relationships and collaborative technology associations over multiple product cycles. Hard drive vendors have good relationships with industry leaders in server and motherboard developments to ensure high-level memory technology.
This is combined with quality expertise used in selecting DRAM and PCB designs. The module assembly is also top-notch, and testing is done to ensure that these server memories meet and exceed industry standards. These memory modules are designed to increase the performance of servers. Each NEMIX module features an aluminum heat spreader to allow quicker heat displacement, supporting the cooler operation. The custom performance module material helps to manage heat in the server, providing superior overclocking headroom in the process.There are multiple colors that will match a wide range of dashboard, components, or individual styles. Also, each product is screened individually to ensure that they provide optimal performance potential. Most PC4 23400 RAMs are optimized to be compatible with the latest DDR4 motherboards. Their compatibility is tested to ensure that they offer the highest frequencies, improved bandwidth, and consume power at a lower level. The module's height is engineered to have a low-profile design to fit into smaller spaces.