Product Overview is a section that provides a general description and summary of the BX80635E52697V2 Intel Xeon 12 Core E5 2697 V2 2.7GHz 30MB L3 130W Processor. It includes information such as the processor's brand, model number, core count, clock speed, cache size, power consumption, and any other relevant details that give an overall understanding of the product.
In this specific case, the BX80635E52697V2 is a processor from Intel's Xeon family. It has 12 cores and 24 threads, which means it can handle multiple tasks simultaneously. It has a base clock speed of 2.7GHz, which is the speed at which the processor can execute instructions. It also has a large 30MB L3 cache, which helps to improve performance by storing frequently used data and instructions. The processor has a TDP (Thermal Design Power) of 130W, which is the amount of power it consumes while operating. This processor is ideal for high-performance computing, data center, and enterprise-level applications that require a high amount of computational power.
Performance FeaturesPerformance features refer to the specific characteristics of a processor that contribute to its overall performance and ability to handle demanding workloads.
The BX80635E52697V2 Intel Xeon 12 Core E5 2697 V2 2.7GHz 30MB L3 130W Processor has several performance features that make it suitable for high-performance computing and enterprise-level applications.
- Multi-core and multi-threading: With 12 cores and 24 threads, this processor can handle multiple tasks simultaneously, which is ideal for workloads that require a high degree of parallelism.
- High clock speed: The processor has a base clock speed of 2.7GHz, which is the speed at which the processor can execute instructions. This high clock speed allows for fast and efficient processing of data.
- Large L3 cache: The processor has a large 30MB L3 cache, which helps to improve performance by storing frequently used data and instructions. This reduces the number of times the processor needs to access main memory, which can slow down processing.
- Advanced instruction sets: The processor supports advanced instruction sets such as AVX2, AVX, and SSE4.2, which can improve performance for specific types of workloads such as multimedia, image and video processing, and scientific simulations.
- Virtualization technology: The processor supports Intel Virtualization Technology which allows multiple operating systems to run on a single physical server. This technology can improve the performance of virtualized applications and environments.
Power efficiency and cooling refer to the processor's ability to operate at a high performance level while consuming minimal power and generating minimal heat.
The BX80635E52697V2 Intel Xeon 12 Core E5 2697 V2 2.7GHz 30MB L3 130W Processor has a TDP (Thermal Design Power) of 130W, which is the amount of power it consumes while operating. This processor is a high-performance processor and it requires a powerful cooling solution to dissipate the heat generated during operation.
To ensure that the processor remains cool and stable, a proper cooling solution must be used. This can include a heatsink and fan combination, liquid cooling, or an integrated cooling system. In a server or data center environment, this will likely be a rack-mounted or air-cooled system that is designed to handle the thermal load of multiple processors.
In addition to a proper cooling solution, the processor also supports Intel's Thermal Monitoring Technology which allows the processor to dynamically adjust its power consumption and clock speed to maintain optimal performance and power efficiency. This can help to reduce power consumption and heat generation without sacrificing performance.
General Information BX80635E52697V2 Intel- Brand : Intel
- Part Number : BX80635E52697V2
- Type : Processor
- Sub-Type: Intel Xeon 12 Core
- Processor Core : 12-Core
- Clock Speed : 2.7 GHz
- Max Turbo Frequency : 3.5 GHz
- Quickpath Interconnect QPI Speed : 8 GT/S
- Instruction Set : 64-Bit
- Instruction Set Extensions : AVX
- L1 Cache : 384 KB
- L2 Cache : 3 MB
- L3 Cache : 30 MB
- Lithography : 22 NM
- Max Thermal Design Power TDP : 130 W
- Compatible Processor Socket : Fclga-2011
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