BX80605X3470 is a powerful processor manufactured by Intel Corporation, a leading manufacturer of computer hardware and software components. In this article, we will provide an in-depth explanation of this processor, including its features, specifications, and performance.
FeaturesBX80605X3470 is a quad-core processor, which means it has four processing cores on a single chip. This allows the processor to handle multiple tasks simultaneously, improving the overall performance of the computer. Additionally, the processor has a clock speed of 2.93GHz, meaning it can execute 2.93 billion instructions per second.
BX80605X3470 also comes with 1MB of L2 cache and 8MB of L3 cache. Cache is a type of memory that stores frequently accessed data and instructions, which improves the processor's efficiency by reducing the time it takes to access this data. The larger the cache, the more efficiently the processor can work. The presence of both L2 and L3 cache in this processor ensures that it can handle complex tasks without any performance hiccups.
BX80605X3470 also has a DMI speed of 2.5 GT/s. DMI, or Direct Media Interface, is a high-speed digital interface used to connect the processor to other components of the computer, such as the chipset, memory, and graphics card. The faster the DMI speed, the faster the processor can communicate with these components, resulting in improved performance.
Socket and Manufacturing ProcessBX80605X3470 is designed to fit into a socket LGA 1156, which is a type of socket used to connect the processor to the motherboard. The socket LGA 1156 is compatible with Intel Core i3, i5, and i7 processors, as well as the Xeon series of processors, which includes BX80605X3470.
BX80605X3470 is manufactured using a 45nm manufacturing process. This refers to the size of the transistors on the processor's die. The smaller the size of the transistors, the more transistors can fit on the die, resulting in a more powerful processor. A 45nm manufacturing process is relatively old compared to the latest processors, which are manufactured using a 7nm process. However, BX80605X3470 is still a powerful processor that can handle complex tasks with ease.
Power ConsumptionBX80605X3470 has a TDP (Thermal Design Power) of 95W. TDP refers to the maximum amount of power that a processor can consume without overheating. This means that BX80605X3470 is a relatively power-hungry processor compared to some of the latest processors that have a TDP of as low as 35W. However, this does not necessarily mean that BX80605X3470 is inefficient. It simply means that the processor requires a certain amount of power to function at its maximum capacity.
PerformanceBX80605X3470 is a powerful processor that can handle complex tasks with ease. It is particularly well-suited for workloads that require multiple cores, such as video editing, 3D rendering, and scientific simulations. The processor's clock speed of 2.93GHz, combined with its cache and DMI speed, ensures that it can handle these workloads without any performance issues.
BX80605X3470 also supports Hyper-Threading Technology, which allows each core to execute two threads simultaneously. This effectively doubles the number of processing threads, improving the processor's performance even further. Additionally, the processor supports Intel Turbo Boost Technology, which allows the clock speed to increase automatically when the processor is under heavy load.
General Information about the Intel BX80605X3470- Manufacturer: Intel
- Model Number or SKU# BX80605X3470
- Product Type: Server Processor
- Processor Core : Quad-Core
- Clock Speed : 2.93 GHz
- Max Turbo Frequency : 3.6 GHz
- Digital Media Interface(Dmi) Speed : 2.5 GT/S
- Instruction Set : 64-Bit
- Nstruction Set Extensions : Sse4.2
- L1 Cache : 256 KB
- L2 Cache : 1 MB
- L3 Cache : 8 MB
- Lithography : 45 NM
- Max Thermal Design Power (Tdp) : 95 W
- Compatible Processor Socket : Lga-1156
- Turbo Boost Technology
- Virtualization Technology(Vt-X)
- Virtualization Technology For Directed I/O(Vt-D)
- Hyper-Threading Technology
- Extended Memory 64 Technology
- Enhanced Speedstep Technology
- Trusted Execution Technology
- Demand Based Switching
- Execute Disable Bit
- Idle States
- Thermal Specification : 162.86°F (72.7°C)
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