HMT31GR7BFR4C-H9 Hynix 8GB PC3-10600 1333MHZ Reg DDR3 SDRAM 240-Pin Ram | New Bulk Pack

HMT31GR7BFR4C-H9 is a memory module made by Hynix, a South Korean semiconductor company. It is an 8GB DDR3 SDRAM memory module designed specifically for use in servers. In this article, we will discuss the features and specifications of the HMT31GR7BFR4C-H9 memory module in detail.

DDR3 SDRAM

DDR3 SDRAM stands for Double Data Rate 3 Synchronous Dynamic Random-Access Memory. DDR3 SDRAM is a type of volatile memory that stores data temporarily and requires a constant power supply to retain the stored information. DDR3 SDRAM operates at higher frequencies and lower voltages than its predecessor, DDR2 SDRAM. It is currently the most common type of memory used in personal computers and servers.

ECC Registered Dual Rank X4

The HMT31GR7BFR4C-H9 memory module is an ECC Registered Dual Rank X4 module. ECC stands for Error-Correcting Code. ECC memory modules use an algorithm to detect and correct errors that occur during data transmission. This is particularly important in servers, where data integrity is crucial. Registered memory, also known as buffered memory, uses a buffer to improve signal integrity and reduce electrical loading. Dual rank memory modules have two sets of memory chips on each side of the module. X4 refers to the fact that each chip has 4 bits of data lines. All of these features contribute to the module’s stability and reliability.

PC3-10600 1333MHz

PC3-10600 is the technical name for DDR3 memory that operates at 1333MHz. The number 10600 refers to the module’s bandwidth in megabytes per second (MB/s), which is calculated by multiplying the frequency (1333MHz) by the number of bits transferred per clock cycle (64). Therefore, the module’s bandwidth is 10666MB/s, which is also referred to as PC3-10600. The higher the bandwidth, the faster the memory can transfer data.

CL9

CL9 stands for CAS Latency 9. CAS Latency is the delay between the time the memory controller requests data from the memory module and the time the data is available. The lower the CAS Latency, the faster the memory can respond to requests. CL9 is a relatively low CAS Latency, which contributes to the module’s speed.

1.5V

The HMT31GR7BFR4C-H9 memory module operates at 1.5 volts. This is the standard voltage for DDR3 memory modules. Operating at a lower voltage reduces the module’s power consumption and heat generation, which is particularly important in servers, where energy efficiency and cooling are critical.

240-Pin DIMM

The HMT31GR7BFR4C-H9 memory module has 240 pins and uses a Dual In-line Memory Module (DIMM) form factor. DIMMs are the most common type of memory module used in servers and personal computers. The number of pins on a DIMM determines the module’s bandwidth and capacity. 240-pin DIMMs are typically used in servers and high-end workstations.

In summary, the HMT31GR7BFR4C-H9 memory module is an 8GB DDR3 SDRAM memory module designed for use in servers. It operates at 1333MHz, has a CAS Latency of 9, and uses ECC Registered Dual Rank X4 technology. The module operates at 1.5 volts and uses a 240-pin DIMM form factor.