BX806955220 Intel Xeon 18 Core Gold 5220 2.2GHz 25MB Cache 10.4GT/S UPI Speed Socket FCLGA3647 14NM 125W Processor. New Factory Sealed 3 Years Intel Warranty.

• 18 Physical Cores for High Performance Multitasking
• 2.2GHz Base Clock Speed with Intel Turbo Boost Technology for Increased Performance
• 25MB SmartCache for Improved Data Access and Processing
• 10.4GT/s UPI Speed for Fast Data Transfer
• 14nm Manufacturing Process for Improved Energy Efficiency
• 125W Thermal Design Power for Reliable Operation
• FCLGA3647 Socket Compatibility for Easy Upgradability
• Intel Hyper-Threading Technology for Improved Thread Processing
• Intel AVX and AVX-512 for Improved Floating Point Performance
• Intel VT-x and VT-d for Improved Virtualization Support
• Intel Enhanced Intel SpeedStep Technology for Dynamic Energy Management
• Intel Execute Disable Bit Technology for Improved Security.

Processor Power Consumption and Thermal Design Power

• 125W Thermal Design Power (TDP)
• Energy-Efficient 14nm Manufacturing Process
• Dynamic Power Management with Intel Enhanced Intel SpeedStep Technology
• Advanced Thermal Solution Requirements
• Power Consumption Optimized for High Performance Computing
• TDP Value Balances Performance and Energy Efficiency
• Higher TDP May Result in Higher System Cooling Requirements
• TDP Can Affect Processor Performance and System Power Usage
• TDP Can Influence Processor Overclocking Potential
• TDP Should be Considered When Selecting Processor and System Components.

Processor Manufacturing Process

The process of manufacturing a processor involves multiple stages, including:

• Design: The process begins with the design of the processor, which involves defining its architecture, microarchitecture, and circuits.
• Fabrication: After the design is complete, the processor is fabricated using a process called photolithography. This involves creating a silicon wafer, depositing various materials onto it, and etching the patterns that make up the circuits.
• Assembly: The fabricated silicon wafers are then cut into individual chips and mounted onto a substrate. The substrate is then encapsulated with a protective material to form the final processor package.
• Testing: After assembly, the processors are tested to ensure that they are functioning properly. This may include both functional testing and performance testing.
• Shipping: The final step is to ship the processors to the customers for use in their products.

Note: This is a high-level overview of the process and it may vary slightly depending on the specific manufacturing process and the company involved.