Description
Performance Features
The Intel Xeon X5690 is a high-performance processor designed for use in enterprise-class servers and workstations. One of its key performance features is its six cores, each operating at a base clock speed of 3.46GHz. This allows for efficient multitasking and parallel processing, making it well-suited for demanding workloads such as data analysis, scientific simulations, and video rendering.
Another important performance feature of the X5690 is its large cache memory. It has 1.5MB of L2 cache per core and 12MB of shared L3 cache, which acts as a high-speed buffer for frequently accessed data. This helps to reduce the number of times the processor needs to access the main memory, resulting in faster performance.
The X5690 also supports Intel’s QuickPath Interconnect (QPI) technology, which provides a high-speed, point-to-point link between the processor and other system components. This allows for faster data transfer and communication between components, resulting in better overall system performance.
Power Consumption
The Intel Xeon X5690 has a thermal design power (TDP) of 130 watts, which refers to the maximum amount of power that the processor is designed to consume under heavy workloads. This value is a measure of the processor’s power efficiency and can be used to estimate the power consumption of a system that uses the X5690.
It’s worth noting that the actual power consumption of the processor will depend on various factors such as the workload, the cooling system, and the other components in the system. A system that uses the X5690 in a lightly loaded environment or with a efficient cooling system will consume less power than one that is heavily loaded or has less efficient cooling.
It’s also important to note that the 130W TDP of the X5690 is relatively high compared to modern processors, so it may not be the best choice for systems that need to minimize power consumption, such as in cases of mobile devices or low power embedded systems.
In general, you should also keep in mind that the Xeon X5690 is a server-grade processor, so it’s not designed for use in energy-efficient consumer devices. If power consumption is a critical factor in your application, you may want to consider processors with lower TDP ratings or other power-saving features.
Compatibility
The compatibility of the Intel Xeon X5690 processor depends on several factors, including the socket type, the chipset, and the system’s BIOS.
The X5690 uses the LGA 1366 socket, which is a specific type of socket that is designed to connect the processor to the motherboard. Not all motherboards have the LGA 1366 socket, so it is important to check that the motherboard you are using or planning to use is compatible with this socket type.
The X5690 also requires a compatible chipset on the motherboard to function properly. The chipset controls communication between the processor, memory, and other components on the motherboard. The X5690 is compatible with several Intel chipsets, including the X58 and the 5520. It’s important to check that the chipset on the motherboard you are using or planning to use is compatible with the X5690.
Finally, it is also important to check that the system’s BIOS is compatible with the X5690. The BIOS is firmware that controls the basic functions of the system, such as booting and power management. Some older systems may have BIOS that is not compatible with the X5690, so it is important to check that the BIOS is up-to-date and compatible with the processor before installing it.
To summarize, the Intel Xeon X5690 processor is compatible with motherboards that have LGA 1366 socket, support for the X58 or 5520 chipset and has a BIOS that supports this processor.
General Information
- Manufacturer : Intel
- Manufacturer Part Number : SLBVX
- Type : Processor
- Sub-Type: Intel Xeon 6 Core
TECHNICAL INFORMATION :
- Processor Core : Six-Core
- Clock Speed : 3.46 GHz
- Max Turbo Frequency : 3.73 GHz
- Quickpath Interconnect QPI Speed : 6.4 GT/S
- Instruction Set : 64-Bit
- Instruction Set Extensions : Sse4.2
CACHE MEMORY DETAIL :
- L1 Cache : 384 KB
- L2 Cache : 1.5 Mb
- L3 Cache : 12 MB
- Lithography : 32 NM
- Max Thermal Design Power TDP : 130 W
- Compatible Processor Socket : Fclga-1366
ADVANCED TECHNOLOGIES :
- Turbo Boost Technology
- Virtualization Technology
- Hyper-Threading Technology
- Extended Memory 64 Technology
- Enhanced Speedstep Technology
- Trusted Execution Technology
