Description
Power Consumption and Thermal Management
The Intel Xeon E7-2860 processor is designed for use in high-performance, mission-critical servers and workstations. With a maximum thermal design power (TDP) of 130 watts, it is designed to consume more power than most processors, but it also offers higher performance and more cores.
To manage power consumption and thermal management, the processor features Intel Advanced Power Management (APM) technology, which allows it to automatically adjust its power consumption based on the workload. This results in improved energy efficiency and thermal management.
In addition, the processor features Intel Turbo Boost Technology, which allows it to increase its clock speed when there is extra power available, resulting in improved performance. This technology is also designed to help reduce power consumption when the processor is idle, by slowing down or shutting off cores that are not in use.
The processor also features Intel Thermal Monitoring Technology, which allows it to monitor its temperature and adjust its power consumption accordingly. This results in improved thermal management and helps to prevent overheating.
Furthermore, the processor also features Intel Power Gate, which allows it to shut down individual cores when they are not in use, resulting in improved energy efficiency.
Advanced Power Management (APM)
Advanced Power Management (APM) is a feature in the SLC3H Intel Xeon Ten Core E7 2860 2.26GHz processor that allows for automatic power management of the system. This can help improve energy efficiency and reduce power consumption by adjusting the processor’s power usage based on the workload.
APM can work by monitoring the system’s power usage and adjusting the processor’s clock speed and voltage accordingly. This can help reduce power consumption when the system is idle or under light loads, and increase performance when the system is under heavy loads.
APM can also work by shutting down or reducing power to certain parts of the processor when they are not in use. For example, it can shut down individual cores or reduce power to the memory controller when it is not needed.
In addition to APM, the SLC3H Intel Xeon Ten Core E7 2860 2.26GHz processor also features other advanced power management features such as Intel Turbo Boost Technology and Intel Hyper-Threading Technology which improves performance and energy efficiency.
Intel Quick Path Interconnect (QPI)
The Intel Quick Path Interconnect (QPI) is a high-speed interconnect technology that allows the SLC3H Intel Xeon Ten Core E7 2860 processor to communicate with other components in the system, such as memory and I/O devices, at faster speeds.
QPI uses a point-to-point architecture to provide a direct connection between the processor and other components, bypassing the traditional front-side bus. This results in faster data transfer rates, improved scalability, and better performance for multi-socket systems.
The SLC3H Intel Xeon Ten Core E7 2860 processor has a QPI speed of 6.4 GT/s, which means it can transfer data at a rate of 6.4 gigatransfers per second. This high-speed interconnect technology allows the processor to handle large amounts of data quickly and efficiently, resulting in improved performance for applications that require high bandwidth and low latency.
QPI also provides a high-speed connection between multiple processors in a multi-socket system, allowing them to share data and work together more efficiently. This improves scalability and performance in high-performance computing and enterprise environments where multiple processors are required.
General Information
- PRODUCT TYPE : SERVER PROCESSOR
- PRODUCT MANUFACTURER : INTEL CORPORATION
- MANUFACTURER PART NUMBER : SLC3H
- PRODUCT MODEL : E7-2860
Technical Information
- PROCESSOR CORE : TEN-CORE
- CLOCK SPEED : 2.26 GHZ
- MAX TURBO FREQUENCY : 2.666 GHZ
- QUICKPATH INTERCONNECT(QPI) SPEED : 6.4 GT/S
- INSTRUCTION SET : 64-BIT
- INSTRUCTION SET EXTENSIONS : SSE4.1/4.2
CACHE MEMORY DETAIL
- SMART CACHE : 24 MB
- LITHOGRAPHY : 32 NM
- MAX THERMAL DESIGN POWER (TDP) : 130 W
- COMPATIBLE PROCESSOR SOCKET : LGA-1567
Advanced Technologies
- TURBO BOOST TECHNOLOGY
- VIRTUALIZATION TECHNOLOGY (VT-X)
- EXTENDED MEMORY 64 TECHNOLOGY
- ENHANCED SPEEDSTEP TECHNOLOGY
- TRUSTED EXECUTION TECHNOLOGY
- THERMAL MONITORING TECHNOLOGIES
