Description
Key Specifications and Features of the RAM Module
The Micron MTA18ASF4G72AZ-3G2F1 32GB 3200Mhz PC4-25600 Cas-22 DDR4 SDRAM Ecc Reg Ram is a high-performance memory module with several key specifications and features that are essential for modern computing systems.
- Capacity: The RAM module has a total capacity of 32GB, which provides ample space for large applications and multitasking.
- Frequency: The memory operates at a frequency of 3200 MHz, which helps in faster data transfer between the memory and the processor, leading to improved system performance.
- PC4-25600: This refers to the maximum data transfer rate of 25,600 MB/s, which is a measure of the memory’s bandwidth. The higher the bandwidth, the faster the memory can access and transfer data.
- CAS Latency (CL): The CL value of 22 refers to the time delay between the moment a command is issued and the moment data is accessible. The lower the CL, the faster the memory can access data.
- DDR4 SDRAM: This is the latest generation of dynamic random-access memory (DRAM) technology that offers improved performance and power efficiency over DDR3.
- ECC (Error Correction Code): ECC is a feature that helps detect and correct errors in data transmission, ensuring data integrity and reliability.
- Registered (Reg): The registered feature allows multiple memory modules to be used in a single computer system, making it suitable for servers and workstations.
These key specifications and features make the Micron MTA18ASF4G72AZ-3G2F1 a suitable choice for high-performance computing systems that require large memory capacity, fast data transfer, and reliable data integrity.
DDR4 SDRAM Technology Overview
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is the latest generation of dynamic random-access memory (DRAM) technology that offers improved performance and power efficiency over its predecessors, DDR3 and DDR2.
- Increased Bandwidth: DDR4 provides a higher data transfer rate compared to DDR3, allowing for faster communication between the memory and the processor.
- Improved Power Efficiency: DDR4 operates at lower voltages compared to DDR3, which results in lower power consumption and improved system reliability.
- Higher Density: DDR4 allows for higher memory density, enabling manufacturers to produce memory modules with larger capacities, up to 16GB per module.
- Increased Reliability: DDR4 includes advanced error correction features, such as ECC (Error Correction Code), which help detect and correct errors in data transmission, ensuring data integrity and reliability.
- Increased Clock Speed: DDR4 memory modules can operate at higher clock speeds compared to DDR3, allowing for faster data access and improved system performance.
CAS Latency and Its Impact on Performance
CAS Latency, also known as CL, is a measure of the time delay between the moment a command is issued to access memory and the moment the data is available. It is one of the key specifications that affects the performance of a memory module.
- Lower Latency is Better: The lower the CL value, the faster the memory can access data, which translates to improved system performance. A lower CL value also means that the memory can respond more quickly to requests from the processor, leading to improved multitasking and overall system responsiveness.
- Latency vs Frequency: It’s important to note that there’s a tradeoff between CAS Latency and frequency. Generally, higher-frequency memory modules have higher CL values, while lower-frequency memory modules have lower CL values.
- Latency and Bandwidth: The CL value also affects the memory’s bandwidth, which is a measure of the maximum data transfer rate. A lower CL value results in higher bandwidth and vice versa.
- Balancing Latency and Frequency: When selecting a memory module, it’s important to consider both the CL value and the frequency, as both affect performance. The ideal memory module for a given system depends on the system’s requirements and the specific applications being used.
General Information of this Micron MTA18ASF4G72AZ-3G2F1
- Brand Name: Micron
- Model Number or SKU# MTA18ASF4G72AZ-3G2F1
- Type: Memory (RAM)
- RAM Type: PC4-25600
- Product Name: 32GB 1rx4 DDR4 SDRAM Rdimm Memory Module
Technical Information about 32GB PC4-25600 Ram
- Storage Capacity: 32GB
- Memory Technology: DDR4 SDRAM
- Number Of Modules: 1 X 32GB
- Bus Speed: 3200Mhz DDR4-25600/PC4-3200
- Data Integrity Check: Ecc
- Signal Processing: Registered
- Cas Latency Timings: Cl22
- Rank Features: 1rx4
- Form Factor: 288-Pin Rdimm
Physical Characteristics for Micron Memory
- Dimensions (W X D X H) : 8.89 X 19.81 X 1.91 Cm (3.5 X 7.8 X 0.75 In)
- Weight: 0.45 Kg (1 Lb)
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