Description
Memory Capacity and Configuration Options
High-Performance Memory for Demanding Applications Advanced Error Correction for Improved Data Integrity Memory Speed and Timing Characteristics Power Consumption and Voltage Requirements Advanced Manufacturing Processes for Improved Reliability Application-Specific Memory Solutions Compatibility with Multiple Systems Reliable and Efficient Performance Industry-Leading Quality and Reliability Optimized for Data Center and Enterprise Applications JEDEC Compliance and Standards Memory Module Form Factor and Dimensions Thermal Characteristics and Operating Temperature Product Warranty and Technical Support Environmental and Regulatory Compliance
High-Performance Memory for Demanding Applications
Reliability and Data Integrity Features Power Consumption and Voltage Requirements Memory Speed and Timing Characteristics Advanced Error Correction (ECC) Technology Compatibility with Multiple Systems Thermal Management Solutions Advanced Manufacturing Processes Memory Controller Optimization System Boot-up and Initialization Application-Specific Memory Solutions Warranty and Technical Support Energy-Efficient Design DDR4 SDRAM Technology Overview Comparison with Other Memory Types Future-Proofing for Next-Generation Systems
Advanced Error Correction for Improved Data Integrity
Memory Speed and Timing Characteristics Power Consumption and Voltage Requirements Reliability and Durability Compatibility with Multiple Systems Advanced Manufacturing Processes Memory Characteristics and Features Data Transfer Rates and Bandwidth Memory Module Design and Form Factor Memory Configuration Options Operating Temperature Range Heat Dissipation and Cooling Solutions Memory Testing and Quality Assurance Memory Warranty and Support Memory Upgrades and Replacement Options Application-Specific Memory Solutions
Memory Speed and Timing Characteristics
- Clock Speed and Latency
- Burst Length and Burst Type
- CAS Latency (CL)
- RAS to CAS Delay (tRCD)
- Row Precharge Time (tRP)
- Active to Precharge Time (tRAS)
- Command Rate (CR)
- Data Transfer Rates
- Bandwidth and Throughput
- Memory Refresh Cycles
- Power Management Features
- Voltage Requirements
- Memory Timing and Latency Optimization
- Memory Preamble and Postamble
- On-Die Termination (ODT) and On-Board Termination (OBT)
General Information about this Micron MTA36ASF8G72PZ-2G9B2R
- Brand Name: Micron
- Model Number or SKU# MTA36ASF8G72PZ-2G9B2R
- Type: Memory (RAM)
- RAM Type: Pc4-23400
- Product Name: 64GB DDR4 SDRAM Memory Module
Specifications of 64GB DDR4 SDRAM Memory
- Capacity: 64 GB
- Memory Technology: DDR4 SDRAM
- Number of Modules: 1 X 64 GB
- Speed: 2933 MHz Ddr4 Pc4-23400
- Data Integrity Check: Ecc
- Signal Processing: Registered
- Rank Features: 2rx4
Physical Characteristics for this Ddr4 Pc4-23400 Ram
- Dimensions (W X D X H): 8.89 X 19.81 X 1.91 Cm (3.5 X 7.8 X 0.75 In)
- Weight: 0.45 Kg (1 LB)
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