Description
Details Information about this HPE 870980-B21
The 870980-B21 HPE Intel Xeon Processor Kit is a high-performance computing solution designed for the HPE ProLiant DL360 Gen10 server. This processor kit features the latest Intel Xeon Platinum 8170 processor, which is a 26-core CPU with a clock speed of 2.1GHz and 35.75MB of L3 cache. It is built on a 14nm process technology and has a thermal design power (TDP) of 165W. In this article, we will provide a detailed explanation of the key features of this processor kit and its benefits for enterprise customers.
Processor Architecture and Specifications
The HPE Intel Xeon Platinum 8170 processor is based on the Skylake-SP architecture and is designed for high-performance computing applications. It features 26 cores and 52 threads, which allows for efficient parallel processing of complex workloads. The processor has a base clock speed of 2.1GHz and can reach up to 3.8GHz with Turbo Boost technology. It also has a massive 35.75MB of L3 cache, which provides fast access to frequently used data.
The processor supports up to 768GB of DDR4 memory with a maximum memory speed of 2666MHz. It also supports advanced technologies such as Intel Hyper-Threading, Intel Turbo Boost, and Intel AVX-512. These features allow the processor to deliver superior performance for complex workloads such as artificial intelligence, machine learning, and data analytics.
UPI Speed and Socket
The HPE Intel Xeon Platinum 8170 processor has a UPI speed of 10.4GT/s, which stands for Gigatransfers per second. UPI is an interconnect technology that allows for high-speed communication between multiple processors in a system. It enables efficient data transfer between the processors, which is critical for high-performance computing applications that require a high level of parallel processing.
The processor is designed to fit into a Socket FCLGA3647, which is a high-end server socket that provides a high-speed interconnect between the processor and the motherboard. This socket is designed to support the latest Intel Xeon Scalable processors, which provide high levels of performance and scalability for enterprise workloads.
Thermal Design Power (TDP)
The HPE Intel Xeon Platinum 8170 processor has a TDP of 165W, which is a measure of the amount of heat that the processor generates under maximum load conditions. TDP is an important consideration for server systems, as it determines the amount of cooling required to maintain stable system operation. The higher the TDP, the more cooling is required, which can impact system design and operating costs.
Benefits of HPE Intel Xeon Processor Kit
The HPE Intel Xeon Processor Kit offers a range of benefits for enterprise customers who require high-performance computing solutions. Some of the key benefits of this processor kit include:
- Superior Performance: The HPE Intel Xeon Platinum 8170 processor delivers superior performance for high-performance computing workloads. With 26 cores and 52 threads, it can efficiently handle parallel processing of complex workloads such as artificial intelligence, machine learning, and data analytics.
- Scalability: The processor supports up to 768GB of DDR4 memory and is designed to fit into a Socket FCLGA3647, which provides high levels of scalability for enterprise workloads. This makes it an ideal solution for businesses that require a high level of performance and scalability for their applications.
- Advanced Technologies: The processor supports advanced technologies such as Intel Hyper-Threading, Intel Turbo Boost, and Intel AVX-512. These features enable the processor to deliver superior performance for a range of applications.
Product Features
- Manufacturer: Hewlett Packard Enterprise(HPE)
- Model Number or SKU# 870980-B21
- Type : Processor
- Sub-Type : Intel Xeon 26 Core
- SKU: 870980-B21
Technical Information
- Processor Core : 26 Core
- Clock Speed : 2.10GHz
- Max Turbo Frequency : 3.70GHz
- Ultrapath Interconnect UPI Speed : 10.4GT/S
- No.Of UPI Links : 3
- Instruction Set : 64-Bit
- Instruction Set Extensions : Intel® Sse4.2, Intel® Avx, Intel® Avx2, Intel® Avx-512
Cache Memory Detail
- L3 Cache : 35.75MB
- Lithography : 14NM
- Max Thermal Design Power TDP : 165W
- Compatible Processor Socket : Fclga3647
Memory Specifications
- Max Memory Size Dependent On Memory Type : 768GB
- Memory Types : DDR4-2666
- Maximum Memory Speed : 2.67GHz
- Max No. Of Memory Channels : 6
- Ecc Memory Supported : Yes
