Description
Product overview of the IBM 59Y4023
The 59Y4023 IBM Intel Xeon Hexa-Core X5650 2.66GHz 1MB L2 Cache 12MB L3 Cache 6.4GT/S Qpi Speed Socket FCGLA-1366 32nm 95w Processor is a high-performance CPU designed for use in enterprise-level servers and workstations. It is manufactured by IBM and features six cores that can run up to 2.66GHz, with 1MB of L2 cache and 12MB of L3 cache. It is built on a 32nm manufacturing process and has a TDP of 95W. In this article, we will take a closer look at the specifications and features of this processor.
Hexa-Core X5650 Processor
The 59Y4023 IBM Intel Xeon Hexa-Core X5650 processor is a high-performance CPU that is designed for use in servers and workstations. It has six cores that can run up to 2.66GHz, which means it is capable of handling a large number of simultaneous tasks. The processor is based on the Westmere architecture, which was introduced by Intel in 2010. This architecture was the successor to the Nehalem architecture and improved upon it by adding support for more cores and increasing the overall performance.
Cache Memory
Cache memory is a type of memory that is used to store frequently accessed data. The 59Y4023 IBM Intel Xeon Hexa-Core X5650 processor has two levels of cache memory. The first level is L1 cache, which is split into two parts: instruction cache and data cache. The instruction cache is used to store frequently used instructions, while the data cache is used to store frequently used data. The second level of cache memory is L2 cache, which is used to store data that is not frequently accessed but still needs to be available quickly. The processor also has a third level of cache memory, L3 cache, which is used to store data that is accessed less frequently than L2 cache but still needs to be available quickly.
QPI Speed
QPI (QuickPath Interconnect) is a high-speed interconnect technology that is used to connect the processor to other components in the system, such as the memory controller, I/O hub, and other processors. The 59Y4023 IBM Intel Xeon Hexa-Core X5650 processor has a QPI speed of 6.4GT/s, which means it is capable of transferring data at a rate of 6.4 billion transfers per second.
Socket FCGLA-1366
The 59Y4023 IBM Intel Xeon Hexa-Core X5650 processor is designed to be used in a Socket FCGLA-1366. This socket is a type of LGA (Land Grid Array) socket that is used to connect the processor to the motherboard. LGA sockets have pins on the motherboard that make contact with pads on the bottom of the processor. This type of socket provides better thermal performance than other types of sockets, as it allows for a larger heatsink to be used.
32nm Manufacturing Process
The manufacturing process used to create a processor is an important factor in determining its performance and power consumption. The 59Y4023 IBM Intel Xeon Hexa-Core X5650 processor is built on a 32nm manufacturing process. This means that the transistors on the processor are 32nm in size, which allows for more transistors to be packed onto the same die area. This results in a more powerful and efficient processor.
95W TDP
TDP (Thermal Design Power) is the maximum amount of heat that a processor can generate under normal operating conditions. The 59Y4023 IBM Intel Xeon Hexa-Core
General Information
- Product Type : Server Processor
- Product Manufacturer : Ibm Corporation
- Part Number or SKU# 59y4023
- Product Model : X5650
Technical Information
- Processor Core : Hexa-Core
- Clock Speed : 2.66 Ghz
- Max Turbo Frequency : 3.06 Ghz
- Quickpath Interconnect(Qpi) Speed : 6.4 Gt/S
Cache Memory Detail
- L1 Cache : 384 Kb
- L2 Cache : 1 Mb
- L3 Cache : 12 Mb
- Lithography : 32 Nm
- Max Thermal Design Power (Tdp) : 95 W
- Compatible Processor Socket : Fclga-1366
Compatibility
- Ibm System X3650 M3(7945) Server
- Advanced Technologies :
- Turbo Boost Technology
- Virtualization Technology
- Hyper-Threading Technology
- Extended Memory 64 Technology
- Enhanced Speedstep Technology
- Trusted Execution Technology
Additional Information
- Demand Based Switching
- Aes New Instructions
- Execute Disable Bit
- Idle States
Environmental Conditions
- Thermal Specification : 178.3°F (81.3°C)Br /
