Description
Introduction to the Intel Xeon Platinum 8170 Processor
The Intel Xeon Platinum 8170 is a high-performance processor designed for use in enterprise data centers and demanding workloads. With 26 cores and a clock speed of 2.1GHz, it offers exceptional processing power and speed, making it ideal for applications such as machine learning, big data analytics, and high-performance computing.
The processor features 35.75MB of L3 cache and a 10.4 GT/s UPI speed, providing fast and efficient data transfer and storage. It is compatible with the Socket FCLGA3647 and uses a 14nm manufacturing process, ensuring power efficiency and reducing heat output. With a TDP of 165W, the Intel Xeon Platinum 8170 is designed to deliver high performance while also reducing energy costs.
In addition to its powerful performance, the Intel Xeon Platinum 8170 also offers advanced security and virtualization features, enhanced memory support, and optimized power management capabilities. With its advanced technology and versatility, the Intel Xeon Platinum 8170 is a top-of-the-line processor that delivers outstanding performance and reliability for demanding enterprise workloads.
L3 Cache and UPI Speed
The Intel Xeon Platinum 8170 comes with a large 35.75 MB L3 cache, providing fast and efficient data storage and retrieval. This large cache size enables the processor to handle complex calculations and data-intensive workloads, delivering improved performance and responsiveness.
The processor also features a 10.4 GT/s UPI (Ultra Path Interconnect) speed, which is the speed at which data can be transferred between the processor and other components within a system. A fast UPI speed ensures that data is transmitted quickly and efficiently, reducing latency and improving overall system performance.
The combination of the large L3 cache and high UPI speed makes the Intel Xeon Platinum 8170 an ideal choice for applications that require high levels of data processing and storage, such as big data analytics and high-performance computing. By providing fast and efficient data storage and retrieval, it enables organizations to quickly process and analyze large amounts of data, making it a critical component for organizations that rely on data-driven insights.
165W TDP and Power Efficiency
The Intel Xeon Platinum 8170 has a Thermal Design Power (TDP) of 165W, which is a measure of the maximum amount of power that the processor is designed to consume. This high TDP reflects the processor’s high performance and large number of cores, but also means that it requires a robust power supply and cooling system to ensure proper operation.
Despite its high TDP, the Intel Xeon Platinum 8170 is designed to be highly power efficient. The 14nm manufacturing process used in the production of the processor helps to reduce power consumption and improve energy efficiency, enabling organizations to save on energy costs while still delivering high levels of performance.
In addition to its efficient manufacturing process, the Intel Xeon Platinum 8170 also features advanced power management technologies that help to reduce power consumption and improve energy efficiency. For example, it supports Intel’s Advanced Vector Extensions 512 (AVX-512), which enables more efficient processing of vector instructions, reducing power consumption and improving performance.
By delivering high performance while maintaining power efficiency, the Intel Xeon Platinum 8170 is an ideal choice for organizations looking to balance the demands of demanding workloads with the need for cost-effective and sustainable computing.
General Information
- product type : server processor
- product manufacturer : intel corporation
- manufacturer part number : CD8067303327601
- product model : platinum 8170
Technical Information
- processor core : 26-core
- clock speed : 2.10GHz
- max turbo frequency : 3.70GHz
- ultra path interconnect(UPI) speed : 10.4GT/S
- no. Of UPI links : 3
- instruction set : 64-bit
- instruction set extensions : INTEL® SSE4.2, INTEL® AVX, INTEL® AVX2, INTEL® AVX-512
Cache Memory Detail:
- L3 CACHE : 35.75MB
- LITHOGRAPHY : 14NM
MAX Thermal Design Power TDP:
- 165W
Compatible Processor Socket :
- FCLGA3647
Memory Specifications:
- max memory size (dependent on memory type) : 768GB
- memory types : DDR4-2666
- maximum memory speed : 2.67GHz
- max no. Of memory channels : 6
- ECC memory supported : yes
