Description
Product Details of the HPE 755386-B21
The HPE Intel Xeon E5-2640V3 processor kit is designed to enhance the performance of the DL360 Gen9 server. This octa-core processor features a clock speed of 2.60 GHz, a large 20MB L3 cache, and an 8GT/s QPI (QuickPath Interconnect) for fast data transfer between the processor and other system components. In this article, we’ll explore the features and specifications of the HPE Intel Xeon E5-2640V3 processor kit in detail.
Octa-Core Processor
The HPE Intel Xeon E5-2640V3 processor is an octa-core processor, which means that it has eight cores capable of processing instructions simultaneously. This makes it ideal for applications that require high-performance computing, such as scientific simulations, virtualization, and database management. With eight cores, the processor can handle more tasks in parallel, which can significantly improve the overall system performance.
Clock Speed
The clock speed of a processor is a measure of how many cycles it can execute in one second. The HPE Intel Xeon E5-2640V3 processor has a clock speed of 2.60 GHz, which means that it can execute 2.6 billion cycles per second. A higher clock speed generally indicates faster performance, but it is not the only factor that determines a processor’s overall speed.
L3 Cache
The L3 cache is a type of memory that is built into the processor itself and is used to store frequently accessed data. The HPE Intel Xeon E5-2640V3 processor has a large 20MB L3 cache, which means that it can store a significant amount of data close to the processor. This reduces the time it takes for the processor to access frequently used data, which can lead to improved system performance.
QPI The QuickPath Interconnect (QPI) is a high-speed point-to-point interconnect that connects the processor to other system components, such as the memory and I/O subsystems. The HPE Intel Xeon E5-2640V3 processor has an 8GT/s QPI, which means that it can transfer data at up to 8 Gigatransfers per second. This fast data transfer speed reduces the time it takes for the processor to access data from other system components, which can improve system performance.
Socket-FCLGA 2011-3
The HPE Intel Xeon E5-2640V3 processor uses the Socket-FCLGA 2011-3, which is a type of socket that is designed for high-performance processors. This socket provides a high-bandwidth interface between the processor and the motherboard, which can improve system performance. The Socket-FCLGA 2011-3 is compatible with a range of server motherboards, including the DL360 Gen9 server.
Power Consumption
The HPE Intel Xeon E5-2640V3 processor has a power consumption of 90 watts, which is relatively low for a high-performance processor. Low power consumption means that the processor generates less heat, which can help reduce cooling requirements and energy costs.
22nm Manufacturing Process
The HPE Intel Xeon E5-2640V3 processor is manufactured using a 22nm process, which means that the transistors on the processor are only 22 nanometers in size. This allows more transistors to be packed onto the processor, which can increase its processing power. Additionally, the 22nm manufacturing process can help reduce power consumption, which can help improve energy efficiency.
Overall, the 755386-B21 HPE Intel Xeon E5-2640V3 Octa Core 2.60GHz 20MB L3 Cache 8GT/S QPI Socket-FCLGA 2011-3 90W 22NM Processor Kit For DL360 Gen9 Server is a high-performance processor that is designed specifically for use in the DL360 Gen9 Server. With its octa-core design, large L3 cache, and support for Hyper-Threading and Turbo Boost technologies, this processor is capable of handling even the most demanding applications with ease.
General Information
- Manufacturer: Hewlett Packard Enterprise(HPE)
- Product Type : Server Processor
- Model Number or SKU# 755386-B21
- Product Model : E5-2640V3
Technical Information
- Processor Core : Octa-Core
- Clock Speed : 2.6 GHz
- Max Turbo Frequency : 3.4 GHz
- Quick path Interconnect(QPI) Speed : 8 GT/S
- Instruction Set : 64-Bit
- Instruction Set Extensions : AVX
Cache Memory Detail
- L3 Cache : 20 MB
- Lithography : 22 NM
- Max Thermal Design Power (TDP) : 90 W
- Compatible Processor Socket : FCLGA-2011-3
- Advanced Technologies :
- Turbo Boost Technology : 2.0
- Hyper-Threading Technology
- Vpro Technology
- Virtualization Technology(VT-X)
- Virtualization Technology For Directed I/O(VT-D)
- Extended Memory 64 Technology
- Enhanced Speed Step Technology
- Trusted Execution Technology
- Thermal Monitoring Technologies
Additional Information
- Demand Based Switching
- Aes New Instructions
- Execute Disable Bit
- Flex Memory Access
- Idle States





